Packaging Devices and Methods for Semiconductor Devices,申请号US201615041919-传众专利搜索

Packaging Devices and Methods for Semiconductor Devices

申请公布号：US2016163657(A1)

申请号：US201615041919

申请日期：2016.02.11

申请公布日期：2016.06.09

申请人：

Taiwan Semiconductor Manufacturing Company, Ltd.

发明人：Hung Wensen

分类号：H01L23/00;H01L21/48;H01L23/367;H01L25/065;H01L23/053;H01L21/56;H01L25/00

主分类号：H01L23/00

地址：Hsin-Chu TW

摘要：Packaging devices and methods for semiconductor devices are disclosed. In some embodiments, a packaging device for a semiconductor device includes a packaging substrate including a semiconductor device mounting region. The packaging device includes a stress isolation structure (SIS) disposed on the packaging substrate proximate a portion of a perimeter of the semiconductor device mounting region.

主权项：1. A method of packaging a semiconductor device, the method comprising: placing a stress isolation structure (SIS) onto a packaging substrate proximate a perimeter of a semiconductor device mounting region of the packaging substrate; coupling a semiconductor device onto the semiconductor device mounting region of the packaging substrate; and adhering at least a first portion of the SIS to the packaging substrate using an underfill material.