Method for mounting a semiconductor element to an interposer by compression bonding,申请号US20020253604-传众专利搜索

Method for mounting a semiconductor element to an interposer by compression bonding

申请公布号：US7060528(B2)

申请号：US20020253604

申请日期：2002.09.25

申请公布日期：2006.06.13

申请人：

MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人：NISHIKAWA HIDENOBU;NISHIDA KAZUTO;SHIMIZU KAZUMICHI;OTANI HIROYUKI

分类号：H01L21/48;H01L23/12;H01L21/301;H01L21/60;H01L21/98;H01L25/065;H01L25/07;H01L25/18

主分类号：H01L21/48

摘要：A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.