DICING APPARATUS AND DICING METHOD

申请公布号：JP2005209884(A)

申请号：JP20040014778

申请日期：2004.01.22

申请公布日期：2005.08.04

申请人：

TOKYO SEIMITSU CO LTD

发明人：NAKAJIMA TSUTOMU

分类号：H01L21/301;(IPC1-7):H01L21/301

主分类号：H01L21/301

摘要：PROBLEM TO BE SOLVED: To provide a dicing apparatus and a dicing method in which a good dicing process can be performed for a wafer adhered to an adhesive sheet. SOLUTION: An ultra-low temperature cooling apparatus 20 is provided near grinding liquid nozzles 14, 15 of the dicing apparatus 10 to cool a grinding liquid by supplying a gas of 0°C or lower to the grinding liquid. Consequently, the clogging of a blade 12 is prevented by cooling and hardening the sheet material and the adhesive material of the adhesive sheet S with the cooled grinding liquid. Moreover, a rise in the cost of dicing equipment can be controlled by utilizing, in the ultra-low temperature cooling apparatus 20, a cooled gas generator for separating compressed gas into cooled gas and hot gas. COPYRIGHT: (C)2005,JPO&NCIPI

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