Semiconductor chip package with stepped connecting element surfaces - has wire bonds from chip to upper steps of elements with encapsulation completely enveloping chip on lower steps

申请公布号：DE4337675(A1)

申请号：DE19934337675

申请日期：1993.11.04

申请公布日期：1994.05.11

申请人：

GOLDSTAR ELECTRON CO., LTD., CHEONGJU, KR

发明人：SONG, CHI JUNG, DAEJON, KR

分类号：H01L23/50;H01L21/56;H01L21/68;H01L23/31;H01L23/495;H01L25/10;H05K3/34

主分类号：H01L23/50

摘要：A number of connecting elements (20) are arranged in two rows facing each other across the upper surface of a strip (10) of polyimide-based adhesive. Each element has a lower step (20a) to which an edge of the chip (1) is fixed with insulating tape (30), and a higher step (20b) to which metallic wire bonds (5) from the chip are secured. The assembly is held together by encapsulating resin (6) which surrounds all sides of the chip but leaves the top and underside of each connecting element exposed. ADVANTAGE - Assembly surface area and mfg. cost are reduced with fewer and simpler process steps and no lead frame.