Resin encapsulated electronic component unit and method of manufacturing the same,申请号EP20040253392-传众专利搜索

Resin encapsulated electronic component unit and method of manufacturing the same

申请公布号：EP1487246(B1)

申请号：EP20040253392

申请日期：2004.06.07

申请公布日期：2008.07.16

申请人：

HONDA MOTOR CO., LTD.

发明人：KIMATA, RYUICHI;WAKITANI, TSUTOMU;YAMASHITA, KOUSEI;KATO, HIRONORI

分类号：H05K3/28;B29C45/14

主分类号：H05K3/28

摘要：Provided are a resin encapsulated electronic component unit which is less apt to develop cracks due to stresses and a method of manufacturing this resin molded electronic component unit. A resin encapsulated electronic component unit 1 includes a printed circuit board 4, mounted electronic components 5a, 5b, 5c, 9a, 9b, and a resin coating layer 3 which covers and encapsulates the electronic components 5a, 7b, 5c, 9a, 9b by insert molding. The resin coating layer 3 is formed from a thermoplastic resin R. The resin encapsulated electronic component unit 1 includes accessory members 6, 6 which are molded from the thermoplastic resin R. The insert molding is performed by use of molds 11a, 11b including cavities 12a, 12b in which the board 2 is disposed and hollow portions 13a, 13b corresponding to the accessory members 6,6, and by injecting the thermoplastic resin R into the hollow portion 13a and discharging air from the hollow portion 13b so that the thermoplastic resin R flows longitudinally of the board 2. The resin coating layer 3 is disposed on both front and back surfaces of the board 2 and the amount of thermoplastic resin R is substantially symmetrically disposed on both front and back surfaces of the board 2. <IMAGE>