METHOD FOR MANUFACTURING EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR,申请号JP20030022571-传众专利搜索

METHOD FOR MANUFACTURING EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

申请公布号：JP2004261966(A)

申请号：JP20030022571

申请日期：2003.01.30

申请公布日期：2004.09.24

申请人：

HITACHI CHEM CO LTD

发明人：ISHIGAWARA MITSUO;TAYA KOJI;YAMADA TATEO;KOBAYASHI RIKIYA;EBIHARA HIDEKI

分类号：B29B7/46;B29B7/84;B29K63/00;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):B29B7/84

主分类号：B29B7/46

摘要：PROBLEM TO BE SOLVED: To provide a method for manufacturing an epoxy resin composition for sealing a semiconductor capable of efficiently discharging a volatile gas even under a continuous operation condition. SOLUTION: In the method for manufacturing the epoxy resin composition for sealing the semiconductor using a kneader, the kneader is constituted so that a suction hole is provided to a kneading part on the downstream side in the feed direction of the epoxy resin composition from the kneading region of the kneading part, and a supply port and a discharge port are respectively provided on the upstream side and downstream side in the feed direction of the epoxy resin composition. Simultaneously with the discharge of the gas in the kneader to the outside through the suction hole, the epoxy resin composition is kneaded while sucking the open air through the supply port and the discharge port. COPYRIGHT: (C)2004,JPO&NCIPI