DIE-BONDING LAYER FORMATION FILM, WORKPIECE HAVING DIE-BONDING LAYER FORMATION FILM ATTACHED THERETO, AND SEMICONDUCTOR DEVICE,申请号SG11201607777U-传众专利搜索

DIE-BONDING LAYER FORMATION FILM, WORKPIECE HAVING DIE-BONDING LAYER FORMATION FILM ATTACHED THERETO, AND SEMICONDUCTOR DEVICE

申请公布号：SG11201607777U(A)

申请号：SG11201607777U

申请日期：2015.03.16

申请公布日期：2016.11.29

申请人：

LINTEC CORPORATION

发明人：AZUMA, YUICHIRO;SUZUKI, HIDEAKI;SAIKI, NAOYA;SAGAWA, YUTA

分类号：H01L21/52

主分类号：H01L21/52

摘要：A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ or more and 50 N/2 mm□ or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.