DEVICE AND METHOD FOR COATING SOLDER ON TERMINAL,申请号JP19830064372-传众专利搜索

DEVICE AND METHOD FOR COATING SOLDER ON TERMINAL

申请公布号：JPS59189069(A)

申请号：JP19830064372

申请日期：1983.04.12

申请公布日期：1984.10.26

申请人：

ALPS DENKI KK

发明人：FUKUYA TAKAMICHI

分类号：B23K1/00;B23K1/08;H01L23/50;H05K3/34

主分类号：B23K1/00

摘要：PURPOSE:To provide a titled device which coats satisfactorily solder on terminal parts by inserting the terminals of parts to the combination of a liquid draining plate having holes for inserting the terminal parts and poor wettability and a strip plate, brazing the terminals by a solder liquid and allowing the solder liquid to ascend along the strip plate. CONSTITUTION:A strip plate 11 is superposed, with sliding pins 13 as a guide, on a liquid draining plate 12 which is formed of titanium, tungsten, aluminum, etc. having poor wettability with solder and has holes 17 for inserting terminals of electronic parts. Terminals 18 of the electronic parts of which the surfaces are preliminarily activated by a flux, etc. are inserted into the holes 17 and are dipped in a solder liquid 5. The ascent of the solder material to the unnecessary part is prevented by the plate 12 having poor wettability so that the solder material ascends along the strip plate 11 having projecting parts 16. The excess brazing material is wiped away and the solder is coated on the terminals 18 in a satisfactory condition. The plate 12 prevents contamination of the electronic parts 2 by solder.