SEMICONDUCTOR WAFER TRANSFER JIG,申请号EP20130823405-传众专利搜索

SEMICONDUCTOR WAFER TRANSFER JIG

申请公布号：EP2879171(A4)

申请号：EP20130823405

申请日期：2013.07.25

申请公布日期：2016.03.09

申请人：

SENJU METAL INDUSTRY CO., LTD.

发明人：MUTSUJI TOSHIHIKO;NAGATA KANAME

分类号：H01L21/673;H01L21/687

主分类号：H01L21/673

摘要：The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in FIG. 1 .