Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces,申请号US20050660993-传众专利搜索

Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces

申请公布号：US7807066(B2)

申请号：US20050660993

申请日期：2005.07.11

申请公布日期：2010.10.05

申请人：

SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人：UENOYAMA MAYO;OKUDA YASUHIRO;HAYASHI FUMIHIRO;FUJITA TARO;MASUDA YASUHITO;IDOMOTO YUICHI

分类号：B31D3/00

主分类号：B31D3/00

摘要：A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.