HEAT CONDUCTIVE COMPONENT, HEAT CONDUCTIVE STRUCTURE, ELECTRONIC COMPONENT MODULE, AND ELECTRONIC APPARATUS,申请号JP20130215373-传众专利搜索

HEAT CONDUCTIVE COMPONENT, HEAT CONDUCTIVE STRUCTURE, ELECTRONIC COMPONENT MODULE, AND ELECTRONIC APPARATUS

申请公布号：JP2015080059(A)

申请号：JP20130215373

申请日期：2013.10.16

申请公布日期：2015.04.23

申请人：

RICOH CO LTD

发明人：YAMASHITA NAOYUKI

分类号：H04N5/225

主分类号：H04N5/225

摘要：<p>PROBLEM TO BE SOLVED: To provide a heat conductive component capable of conducting heat from a heating element even if a contacted surface of the heating element has an irregular shape.SOLUTION: Heat from a first substrate 11 or a second substrate 12, which serves as a heating element, is conducted to a heat conductive component 1. The heat conductive component 1 has a contact surface 2 which makes surface contact with the first substrate 11 or the second substrate 12 serving as the heating element. The contact surface 2 is formed into an irregular shape matching with an irregular shape of an electronic component placed on a contacted surface of the first substrate 11 or the second substrate 12 serving as the heating element, which faces the contact surface 2.</p>