METAL ETCH SYSTEM,申请号US201414508648-传众专利搜索

METAL ETCH SYSTEM

申请公布号：US2015197861(A1)

申请号：US201414508648

申请日期：2014.10.07

申请公布日期：2015.07.16

申请人：

MEI, LLC

发明人：Tice Scott;Wagner Jeffrey M.

分类号：C23F1/08;C23F1/14

主分类号：C23F1/08

地址：Albany OR US

摘要：Embodiments of systems and methods of etching material from the surface of a wafer are provided. In one representative embodiment, an apparatus comprises a fluid reservoir configured to receive a fluid including an etchant and one or more wafers in a cassette. The apparatus can further comprise a roller member in the fluid reservoir to frictionally engage the one or more wafers and to displace the one or more wafers with respect to a bottom portion of the cassette when the cassette is in the fluid reservoir. The apparatus can further comprise a motor outside the fluid reservoir and magnetically coupled to the roller member such that activation of the motor causes corresponding rotation of the roller member, and thereby rotation of the one or more wafers when the roller member is in frictional engagement with the one or more wafers.

主权项：1. An apparatus comprising: a fluid reservoir configured to receive a fluid including an etchant and a cassette configured to receive one or more wafers; a roller member in the fluid reservoir to frictionally engage the one or more wafers when the cassette is in the fluid reservoir; and a motor situated outside the fluid reservoir and coupled to the roller member such that activation of the motor causes corresponding rotation of the roller member and rotation of the one or more wafers when the roller member is in frictional engagement with the one or more wafers; wherein the one or more wafers are displaced with respect to a bottom portion of the cassette when the cassette is in the fluid reservoir.