POLISHING LIQUID COMPOSITION FOR SILICON WAFERS,申请号JP20130265491-传众专利搜索

POLISHING LIQUID COMPOSITION FOR SILICON WAFERS

申请公布号：JP2015122411(A)

申请号：JP20130265491

申请日期：2013.12.24

申请公布日期：2015.07.02

申请人：

KAO CORP

发明人：MIURA JOJI;MATSUI YOSHIAKI;KATO YUKI

分类号：H01L21/304;B24B37/00;C09G1/02;C09K3/14

主分类号：H01L21/304

摘要：<p>PROBLEM TO BE SOLVED: To provide a polishing liquid composition for silicon wafers which enables the decrease in the surface roughness (haze) of a silicon wafer and the surface defect (LPD), and others.SOLUTION: A polishing liquid composition for silicon wafers comprises: silica particles; a nitrogen-containing basic compound; and copolymer including a constitutional unit I expressed by the formula (1) below and a constitutional unit II expressed by the formula (2). In the formula (2), n is an average additional mole number of ethylene oxy groups, which is a number of 2-100. In the copolymer, the mass proportion (Mass of the constitutional unit I/Mass of the constitutional unit II) of the constitutional unit I expressed by the formula (1) to the constitutional unit II expressed by the formula (2) is preferably 50/50 to 99/1. [Chem. 1]</p>