絶縁基板用積層材

申请公布号：JP5666372(B2)

申请号：JP20110093713

申请日期：2011.04.20

申请公布日期：2015.02.12

分类号：H01L23/12;H01L23/14

主分类号：H01L23/12

摘要：<p><P>PROBLEM TO BE SOLVED: To provide a laminated material used for an insulating substrate, which has a good property of solder joint and can prevent cracking and peeling at a joint interface surface. <P>SOLUTION: A laminated material 1A comprises: a Ni layer 2 formed of Ni or Ni alloy, on whose surface 2a a semiconductor element 21 is jointed; a Ti layer 4 formed of Ti or Ti alloy, which is arranged on one side of the Ni layer 2; and an Al layer 6 formed of Al or Al alloy, which is arranged in a laminated form at a side of the Ti layer 4 that is opposite to another side where the Ni layer 2 is arranged. The Ni layer 2 and the Ti layer 4 are joined together by using a discharge plasma sintering method. The Ti layer 4 and the Al layer 6 are joined together by using a discharge plasma sintering method. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>

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