X-ray stress measurement method and apparatus,申请号US201313917829-传众专利搜索

X-ray stress measurement method and apparatus

申请公布号：US8953743(B2)

申请号：US201313917829

申请日期：2013.06.14

申请公布日期：2015.02.10

申请人：

Rigaku Corporation

发明人：Yasukawa Shoichi

分类号：G01N23/20;G01L1/25;G01N23/207

主分类号：G01N23/20

代理机构：

Westerman, Hattori, Daniels & Adrian, LLP

代理人：Westerman, Hattori, Daniels & Adrian, LLP

地址：Tokyo JP

摘要：A sample (1) is irradiated with X-rays at different incident angles from plural X-ray sources (21, 22). Attention is focused on a Debye-ring of each X-ray diffraction emitted conically from the sample in association with incident X-ray from each of the X-ray sources (21, 22), and stress in the sample (1) is determined on the basis of information of X-ray diffraction appearing at an intersection point between the Debye-ring of the X-ray diffraction recorded on an image plate (30) and an equatorial plane (H) and information of X-ray diffraction appearing in the neighborhood of the intersection point between the Debye-ring and the equatorial plane (H).

主权项：1. An X-ray stress measurement method comprising: irradiating a sample with X-rays at a plurality of different incident angles from a plurality of X-ray sources; focusing attention on a Debye-ring of each X-ray diffraction radiated conically from the sample in association with incident X-ray emitted from each of the X-ray sources; and determining stress in the sample on the basis of information of X-ray diffraction appearing at an intersection point between the Debye-ring and an equatorial plane containing an optical axis of the incident X-ray emitted from each of the X-ray sources, and information of X-ray diffraction appearing at a point on the Debye-ring other than the intersection point between the Debye-ring and the equatorial plane.