Humidifier

申请公布号：US8794601(B2)

申请号：US201113328345

申请日期：2011.12.16

申请公布日期：2014.08.05

申请人：

Carrier Corporation

发明人：Dempsey Daniel J.;Brown Michael L.

分类号：B01F3/04

主分类号：B01F3/04

代理机构：

Cantor Colburn LLP

代理人：Cantor Colburn LLP

地址：Farmington CT US

摘要：A humidifier is provided and includes a membrane, which is permeable to water of a condensate supply but impermeable to acid of the condensate supply and a housing system to urge airflow across the membrane to humidify air with the water of the condensate supply.

主权项：1. A humidifier, comprising: a membrane, which is permeable to water of a condensate supply but impermeable to acid of the condensate supply; and a housing system to urge airflow across the membrane to humidify air with the water of the condensate supply.

CONNECTOR AND CONNECTOR FITTING STRUCTURE

DEVICE, INFORMATION PROCESSING METHOD, PROGRAM AND INFORMATION STORAGE MEDIUM

LIQUID DISCHARGE DEVICE

PLASMA ETCHING METHOD, AND PLASMA ETCHING APPARATUS

IMAGE FORMING APPARATUS

IC CARD AND IC CARD CONTROL METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICE

SEMICONDUCTOR DEVICE

GAME MACHINE

GAME MACHINE

METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE DEVICE

INDUCTION HEATING COOKER

PIPE FIXING MEMBER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STORAGE DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR STORAGE DEVICE

AUTOMATIC CONVEYANCE SYSTEM

EDUCATION INFORMATION MANAGEMENT COMPUTER PROGRAM, EDUCATION INFORMATION MANAGEMENT COMPUTER SYSTEM

RESIN COMPOSITION, PRIMER LAYER FOR PLATING PROCESS, PRIMER LAYER FOR PLATING PROCESS WITH SUPPORT BODY, PRIMER LAYER FOR PLATING PROCESS AFTER CURING, LAMINATE SHEET FOR WIRING BOARD, PROCESS OF MANUFACTURING LAMINATE SHEET FOR WIRING BOARD, MULTILAYER WIRING BOARD, AND PROCESS OF MANUFACTURING MULTILAYER WIRING BOARD

PEELING METHOD, AND SEMICONDUCTOR DEVICE

MUTUAL CONDUCTANCE ADJUSTMENT CIRCUIT, FILTER CIRCUIT, AND ELECTRONIC APPARATUS