Light emitting device package
申请公布号:EP2736086(A2)
申请号:EP20130176342
申请日期:2013.07.12
申请公布日期:2014.05.28
发明人:PARK DAEHYUN;HONG, GUNYONG;YOO, YOUNGGIL;KANG, DONGWON
分类号:H01L33/50
主分类号:H01L33/50
摘要:A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.
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