HEAT DISSIPATION SYSTEM FOR POWER MODULE,申请号JP20120197464-传众专利搜索

HEAT DISSIPATION SYSTEM FOR POWER MODULE

申请公布号：JP2013247354(A)

申请号：JP20120197464

申请日期：2012.09.07

申请公布日期：2013.12.09

申请人：

SAMSUNG ELECTRO-MECHANICS CO LTD

发明人：KWAK YOUNG HOON;OH KYU HWAN

分类号：H01L23/473;H05K7/20

主分类号：H01L23/473

摘要：PROBLEM TO BE SOLVED: To provide a heat dissipation system for a power module capable of efficiently dissipating heat generated from a power module.SOLUTION: Disclosed herein is a heat dissipation system for a power module, including: a manifold 110 including an inlet and an outlet and formed to be opened at a surface thereof in contact with a nozzle member 120; a nozzle member 120 formed at an upper portion of the manifold 110 and including inclined nozzles through which a cooling medium introduced through the inlet of the manifold 110 passes; and a nozzle chamber 130 formed on the nozzle member 120 and forming a separation space separated from the nozzle member 120.