Semiconductor chip device with liquid thermal interface material

申请公布号：US8574965(B2)

申请号：US20100910379

申请日期：2010.10.22

申请公布日期：2013.11.05

申请人：

REFAI-AHMED GAMAL;SU MICHAEL Z.;BLACK BRYAN;ATI TECHNOLOGIES ULC;ADVANCED MICRO DEVICES, INC.

发明人：REFAI-AHMED GAMAL;SU MICHAEL Z.;BLACK BRYAN

分类号：H01L21/00

主分类号：H01L21/00

摘要：A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board.

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