用于3D封装的应力补偿层

申请公布号：CN103208465A

申请号：CN201210139446.3

申请日期：2012.05.07

申请公布日期：2013.07.17

申请人：

台湾积体电路制造股份有限公司

发明人：林俊宏;陈玉芬;普翰屏;郭宏瑞

分类号：H01L23/31(2006.01)I;H01L21/56(2006.01)I

主分类号：H01L23/31(2006.01)I

代理机构：

北京德恒律师事务所 11306

代理人：陆鑫;房岭梅

地址：中国台湾新竹

摘要：提供了用于封装的应力补偿层及其形成方法。应力补偿层放置在基板的与集成电路管芯相对的面上。应力补偿层被设计成抵消由位于基板的管芯面上的结构施加的至少一些应力，诸如，由至少部分地封装第一集成电路管芯的模塑料所施加的应力。封装件也可以与基板电连接。本发明提供了用于3D封装的应力补偿层。

主权项：一种半导体器件，包括：第一基板，具有第一面和第二面；第一管芯，安装在所述第一基板的所述第一面上；模塑料，形成在所述第一基板的所述第一面的至少一部分的上方；应力补偿层，形成在所述第一基板的所述第二面的上方；以及第二基板，在所述第一面上与所述第一基板电连接。

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