首页 > 专利信息

System and method for directionally radiating sound

申请公布号:US8483402(B2)

申请号:US11780461

申请日期:2007.07.19

申请公布日期:2013.07.09

分类号:H04B0001/000000;H04B0003/000000;H04R0001/000002;H04R0005/000002

主分类号:H04B0001/000000

摘要:A method of operating an audio system that provides audio radiation to a plurality of listening positions includes providing at least one source of audio signals. At each listening position, at least one array of speaker elements is provided. A filter is provided between the at least one source and at least one of the speaker elements at a first listening position. The filter is optimized so that the filter reduces acoustic energy radiated from the first array to at least one other listening position of the plurality of listening positions, compared to acoustic energy radiated from the first array to the first listening position.

专利推荐

MANUFACTURING METHOD OF OXIDE SEMICONDUCTOR THIN FILM TRANSISTOR

METHOD FOR FABRICATING FINFET WITH SEPARATED DOUBLE GATES ON BULK SILICON

SEMICONDUCTOR DEVICE AND FORMATION THEREOF

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Array Substrate and Method for Fabricating the Same, and Display Device

CMOS TRANSISTORS INCLUDING GATE SPACERS OF THE SAME THICKNESS

Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures

OPTOELECTRONIC ASSEMBLY AND METHOD OF OPERATING AN OPTOELECTRONIC ASSEMBLY

Assembly Method, of the Flip-Chip Type, for Connecting Two Electronic Components, Assembly Obtained by the Method

APPARATUS FOR EUTECTIC BONDING

METHOD OF FORMING AN INSULATOR LAYER IN A SEMICONDUCTOR STRUCTURE AND STRUCTURES RESULTING THEREFROM

PHOTORESIST COLLAPSE METHOD FOR FORMING A PHYSICAL UNCLONABLE FUNCTION

WIRING STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME

SILICON-GLASS HYBRID INTERPOSER CIRCUITRY

WAFER HANDLER AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

METHOD FOR BONDING BY MEANS OF MOLECULAR ADHESION

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING AN OXIDE LAYER

METHOD FOR MANUFACTURING SILICON-CONTAINING THIN FILM