MOUNTING SUBSTRATE MOUNTED WITH TEMPERATURE FUSE, AND MOUNTING METHOD OF TEMPERATURE FUSE,申请号JP20110097794-传众专利搜索

MOUNTING SUBSTRATE MOUNTED WITH TEMPERATURE FUSE, AND MOUNTING METHOD OF TEMPERATURE FUSE

申请公布号：JP2012230797(A)

申请号：JP20110097794

申请日期：2011.04.26

申请公布日期：2012.11.22

申请人：

PANASONIC CORP

发明人：MORIMOTO KOICHI;NAGAFUJI KOHEI;SENDA KENJI;TOMITA HIROSHI

分类号：H01H85/143;H01H69/02

主分类号：H01H85/143

摘要：<P>PROBLEM TO BE SOLVED: To provide a mounting substrate mounted with a temperature fuse and a mounting method of the temperature fuse, whereby the mounting substrate receives no influence even if laser conditions slightly vary. <P>SOLUTION: In a mounting substrate 21 for mounting a temperature fuse that includes a first and second metal terminals 11, 12 composed by Ni or an alloy having Ni as a main component, a fusible alloy 14 bridged between one end part 11a of the first metal terminal 11 and one end part 12a of the second metal terminal 12, and insulating films 15, 16 covering the fusible alloy 14, the first metal terminal 11 and the second metal terminal 12 are connected to a pair of land patterns 22 formed on the top face of the mounting substrate 21 by laser through a metal layer 23 formed on the top face, and the same material as the material composing the first and second metal terminals 11, 12 are used for the material of the metal layer 23. <P>COPYRIGHT: (C)2013,JPO&INPIT