MATRIX SUBSTRATE SHEET, SEMICONDUCTOR PACKAGE SUBSTRATE, AND METHOD OF MANUFACTURING THEM,申请号JP20100037227-传众专利搜索

MATRIX SUBSTRATE SHEET, SEMICONDUCTOR PACKAGE SUBSTRATE, AND METHOD OF MANUFACTURING THEM

申请公布号：JP2011176007(A)

申请号：JP20100037227

申请日期：2010.02.23

申请公布日期：2011.09.08

申请人：

HITACHI CHEM CO LTD

发明人：NISHIDA NORIHIRO

分类号：H01L23/12;H05K1/02;H05K3/00;H05K3/28

主分类号：H01L23/12

摘要：PROBLEM TO BE SOLVED: To provide a matrix substrate sheet which, when a plurality of individual semiconductor package substrates which are arranged are processed by dicing, can suppress the contamination of surfaces of the semiconductor package substrates, and also to provide the semiconductor package substrates, and the methods of manufacturing the matrix substrate sheet and the semiconductor package substrates. SOLUTION: The matrix substrate sheet is formed by arranging the plurality of semiconductor package substrates including a base material, a wiring pattern provided on the base material, and solder resist formed on the base material and wiring pattern. The matrix substrate sheet is configured to have, at each of boundaries between the plurality of semiconductor package substrates which are arranged: a relief part of the wiring pattern; solder resist forming a recessed part at the relief part; a dicing region provided in the relief part; and a groove part of the solder resist provided in the dicing region. The semiconductor package substrates are fabricated by dicing the matrix substrate sheet. Then, the methods of manufacturing the matrix substrate sheet and the semiconductor package substrates are provided. COPYRIGHT: (C)2011,JPO&INPIT