Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling,申请号US20090491281-传众专利搜索

Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling

申请公布号：US8014150(B2)

申请号：US20090491281

申请日期：2009.06.25

申请公布日期：2011.09.06

申请人：

INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人：CAMPBELL LEVI A.;CHU RICHARD C.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E.

分类号：H05K7/20;G06F1/20;H01L23/34

主分类号：H05K7/20

摘要：Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins.