FLIP CHIP OVERMOLD PACKAGE

申请公布号：EP2311084(A2)

申请号：EP20090774419

申请日期：2009.07.01

申请公布日期：2011.04.20

申请人：

ALTERA CORPORATION

发明人：TECK-GYU, KANG

分类号：H01L23/31;H01L21/56;H01L23/00;H01L23/42;H01L23/433

主分类号：H01L23/31

摘要：An integrated circuit (IC) package having a packaging substrate, an IC disposed onto the packaging substrate, and a rigid support member attached to the substrate layer through an adhesive spacer is provided. The packaging substrate includes multiple decoupling capacitors positioned thereon around the IC. A heat sink is placed over the IC. The rigid support member provides enhanced structural support for the IC packaging and there is ample space between a bottom surface of the rigid support member and the packaging substrate to allow the placement of the decoupling capacitors underneath the rigid support member.

Cross-linking of modified engineering thermoplastics

Flap openings in a grain harvesting threshing and separation unit

Thin film transistor and manufacturing method of thin film transistor

Medicaments

Make-up brush and method for manufacturing such a brush

Diffusing adhesive layer, optical member and liquid-crystal display device

In-plane switching mode liquid crystal display device

Charge roller of developing device for image forming apparatus, method for fabricating the same and tool for fabricating charge roller

Method of starting and stopping methanol reforming apparatus and apparatus for supplying fuel to said apparatus

Pharmaceutical dosing dispenser

Surgical stapler

Endotracheal tube for use during fiberoptic assisted intubation and with other intubating stylets

Rotary atomizer for particulate paints

Boat

Frame type photograph mounting assembly

Optical node system for a ring architecture and method thereof

Idle speed control valve control system

Methods and kits for treating and diagnosing leiomyomas

Navigation device

Method and apparatus for the replacement of non-operational metal lines in DRAMS