BALL-GRID-ARRAY PACKAGE, ELECTRONIC SYSTEM AND METHOD OF MANUFACTURE,申请号US20100705846-传众专利搜索

BALL-GRID-ARRAY PACKAGE, ELECTRONIC SYSTEM AND METHOD OF MANUFACTURE

申请公布号：US2011037158(A1)

申请号：US20100705846

申请日期：2010.02.15

申请公布日期：2011.02.17

申请人：

YOUN SUNPIL;OH KWANYOUNG

发明人：YOUN SUNPIL;OH KWANYOUNG

分类号：H01L25/065;H01L23/498

主分类号：H01L25/065

摘要：A multiple-chip-package (MCP) has multiple chip groups and multiple package terminal groups for electrical connections in the MCP. Semiconductor chips of the same chip group are electrically connected to the package terminals of the same package terminal group, while package terminals of different chip groups are electrically connected to the package terminals of different package terminal groups.