ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME

申请公布号：US2010047968(A1)

申请号：US20070519510

申请日期：2007.12.13

申请公布日期：2010.02.25

发明人：AMANO YASUHIRO;TERADA YOSHIO;TAKAMOTO NAOHIDE

分类号：H01L21/78;B32B5/16;C08K3/36

主分类号：H01L21/78

摘要：The present invention relates to an adhesive sheet for producing a semiconductor device, which is used when a semiconductor element is caused to adhere onto an adherend and the semiconductor element is wire-bonded, in which a lipophilic lamellar clay mineral is contained.

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