堆叠封装

申请公布号：CN101595562A

申请号：CN200780050474.5

申请日期：2007.12.20

申请公布日期：2009.12.02

申请人：

泰塞拉公司

发明人：B·哈巴

分类号：H01L25/065(2006.01)I;H01L23/48(2006.01)I

主分类号：H01L25/065(2006.01)I

代理机构：

永新专利商标代理有限公司

代理人：王琼先;王永建

地址：美国加利福尼亚

摘要：一种微电子组件(34)，包括带有第一后表面(16)的第一微电子元件(12)。该组件进一步包括带有第二后表面(16a)的第二微电子元件(12a)。第二微电子元件(12a)连接于第一微电子元件(12)以形成堆叠封装(34)。第一微电子元件(12)的第一后表面(16)面向第二微电子元件(12a)的第二后表面(16a)。

主权项：1.一种微电子组件，包括：带有第一后表面的第一微电子元件；带有第二后表面的第二微电子元件，该第二微电子元件连接于第一微电子元件以形成堆叠封装；其中第一微电子元件的第一后表面面向第二微电子元件的第二后表面；且至少一个桥接元件，其中第一微电子元件和第二微电子元件每个都具有前表面和暴露于前表面处的多个触点，其中所述至少一个桥接元件在第一微电子元件的所述多个触点与第二微电子元件的所述多个触点之间延伸以将二者电连接。

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