METHOD OF FILLING THROUGH-HOLE,申请号JP20070051997-传众专利搜索

METHOD OF FILLING THROUGH-HOLE

申请公布号：JP2008214679(A)

申请号：JP20070051997

申请日期：2007.03.01

申请公布日期：2008.09.18

申请人：

SHINKO ELECTRIC IND CO LTD

发明人：TANAKA SHUICHI

分类号：C25D7/00;C25D5/18;H05K3/42

主分类号：C25D7/00

摘要：PROBLEM TO BE SOLVED: To solve a problem in a conventional method of filling a through-hole, which includes filling the inside of the through-hole with a plating metal through an electrolytic metal plating process with the use of an electrolytic plating solution, which needs to a great attention to the control. SOLUTION: This filling method includes the steps of: forming a metallic thin film 14 on the whole area of a substrate surface including the inner wall surface of the through-hole 12 which penetrates through a substrate 10 made from an insulation material; covering one surface side of the substrate 10 in which one of open parts of the through-hole 12 is opened, with a first insulation film 16; forming a plated metal layer 18 on the other side of the substrate 10 in which the other open part of the through-hole 12 is opened, so as to block the other open part of the through-hole 12 while filling the other open part side of the through-hole 12 with the plating metal, through a first electrolytic metal plating step which uses the metallic thin film 14 as a power-feeding layer; subsequently peeling the first insulation film 16 and opening the one side of the open part of the through-hole 12; and forming a plated film on the one surface side of the substrate 10 so as to fill a space 12a remaining in the one open part side of the through-hole 12 with a plating metal through a second electrolytic metal plating step which uses the metallic thin film 14 as the power-feeding layer. COPYRIGHT: (C)2008,JPO&INPIT