TRANSPARENT EPOXY RESIN COMPOSITION FOR MOLDING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME

申请公布号：KR100858967(B1)

申请号：KR20070009620

申请日期：2007.01.30

申请公布日期：2008.09.17

分类号：C08L63/00;C08K5/17;H01L33/54;H01L33/56;H01L33/62

主分类号：C08L63/00

摘要：In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: R1: a hydrogen atom (—H), an alkyl group, or a phenyl group R2: an alkyl group (—CH3, —C2H5, —C3H7).

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