Semiconductor device and method of producing the same,申请号US20070652120-传众专利搜索

Semiconductor device and method of producing the same

申请公布号：US2007238289(A1)

申请号：US20070652120

申请日期：2007.01.11

申请公布日期：2007.10.11

申请人：

OKI ELECTRIC INDUSTRY CO., LTD.

发明人：TANAKA YASUO

分类号：H01L21/44

主分类号：H01L21/44

摘要：A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a resin layer. The method further includes the steps of polishing the resin layer until an upper surface of the protrusion electrode is exposed; polishing the exposed upper surface of the protrusion electrode; and forming a solder terminal on the polished upper surface of the protrusion electrode.