MODULARIZATION RADIATOR,申请号JP20050156741-传众专利搜索

MODULARIZATION RADIATOR

申请公布号：JP2006148047(A)

申请号：JP20050156741

申请日期：2005.05.30

申请公布日期：2006.06.08

申请人：

FORWARD ELECTRONICS CO LTD

发明人：HUANG JUNG-FONG;WONG CHI-KIN

分类号：H01L23/473;F25D9/00;F25D17/02;F28D1/00;F28D1/047;F28F1/32;F28F9/26;G06F1/20;H05K7/20

主分类号：H01L23/473

摘要：PROBLEM TO BE SOLVED: To provide a modularization radiator whose radiating efficiency is high. SOLUTION: This modularization radiator includes at least two radiating modules arrayed back and forth and at least one connecting pipe. Each radiating module includes a plurality of radiating fins, a plurality of heat exchanging pipes, two fixing plates, a plurality of first curved pipes and a plurality of second curved pipes. The plurality of first curved pipes are connected to first vertical outside two adjacent heat exchanging pipes, and the plurality of second curved pipes are connected to second vertical outside two adjacent heat exchanging pipes. The heat exchanging pipes are serially connected so that a continuous S-shaped conduct can be formed, and each S-shaped conduit includes an entrance and exit, and the connecting pipe is connected to the exit of the S-shaped pipe of one of the radiating modules and the entrance of the S-shaped conduit of the next radiating module. COPYRIGHT: (C)2006,JPO&NCIPI