ALKALI METAL-FREE DETERGENT BEFORE PLATING,申请号JP20040292497-传众专利搜索

ALKALI METAL-FREE DETERGENT BEFORE PLATING

申请公布号：JP2006104515(A)

申请号：JP20040292497

申请日期：2004.10.05

申请公布日期：2006.04.20

申请人：

NIKKO MATERIALS CO LTD

发明人：SEKIGUCHI JIYUNNOSUKE;IMORI TORU

分类号：C23C18/18;C11D7/32;C11D7/36;H01L21/288;H01L21/304

主分类号：C23C18/18

摘要：PROBLEM TO BE SOLVED: To provide an alkali metal-free alkali detergent used for cleaning for the purpose of uniformly applying plating to a semiconductor wafer or the like and for alkali cleaning for the purpose of improving its wettability. SOLUTION: The alkali metal-free detergent before plating comprises phosphoric acid or the salt thereof, and to which strong alkalinity of pH≥11.5 is imparted by the salt of tetraalkylammonium hydroxide. COPYRIGHT: (C)2006,JPO&NCIPI