APPARATUS AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS USING ONE OR MORE POLISHING SURFACES,申请号KR20057019953-传众专利搜索

APPARATUS AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS USING ONE OR MORE POLISHING SURFACES

申请公布号：KR20060017591(A)

申请号：KR20057019953

申请日期：2005.10.20

申请公布日期：2006.02.24

申请人：

INOPLA INC.

发明人：JEONG, IN KWON

分类号：H01L21/304;B24B37/04;B24B37/34;B24B51/00

主分类号：H01L21/304

摘要：An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and- unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.