RADIATOR,申请号JP20040129910-传众专利搜索

RADIATOR

申请公布号：JP2005311257(A)

申请号：JP20040129910

申请日期：2004.04.26

申请公布日期：2005.11.04

申请人：

SHARP CORP

发明人：BASHIZAKA TOYOKI;TAKIMOTO TORU

分类号：H05K7/20;H01L23/36;(IPC1-7):H01L23/36

主分类号：H05K7/20

摘要：PROBLEM TO BE SOLVED: To provide a radiator which can make a mounting space on a printed circuit board substantially small and can increase a heat radiation efficiency of an electronic component to be mounted. SOLUTION: A recess 1h for mounting an electronic component 2 therein is formed in part of an outer surface of a heat dissipating object 1 from which heat of the electronic component 2 is to be dissipated. The recess 1h is formed so that part of the electronic component 2 other than a connection terminal 2g is not projected from the outer surface of the object. The heat radiator 1 is formed so that at least a mounting surface of the electronic component 2 is brought into tight contact with the inner wall of the recess 1h. COPYRIGHT: (C)2006,JPO&NCIPI