METHOD FOR TREATING PLASTIC SURFACE PATTERN-FORMED BY LASER,申请号JP20050083238-传众专利搜索

METHOD FOR TREATING PLASTIC SURFACE PATTERN-FORMED BY LASER

申请公布号：JP2005303288(A)

申请号：JP20050083238

申请日期：2005.03.23

申请公布日期：2005.10.27

申请人：

ENTHONE INC

发明人：SCHILDMANN MARK PETER

分类号：B08B3/08;B08B3/12;C23C18/16;C23G1/00;H05K3/00;H05K3/18;(IPC1-7):H05K3/18

主分类号：B08B3/08

摘要：PROBLEM TO BE SOLVED: To provide a method for removing metal cores that are not desired and deposited before metallization from a substrate surface without eternally damaging a conductive path pattern-formed by design. SOLUTION: In a method for treating a plastic substrate pattern-formed on a surface by laser in order to form a core pattern suitable for later metallization, after pattern formation by laser, a substrate is made to come into contact with a process liquid suitable for removing undesired deposition that has occurred during the period of pattern formation. If the substrate pattern-formed by laser is treated with a mixture of a wetting agent and a substance that promotes cleaning before metallization, the metal cores deposited against the desire can be removed sufficiently and the conductive path pattern-formed by design is not eternally damaged. COPYRIGHT: (C)2006,JPO&NCIPI