Wiring board comprising granular magnetic film,申请号US20030655823-传众专利搜索

Wiring board comprising granular magnetic film

申请公布号：US6919772(B2)

申请号：US20030655823

申请日期：2003.09.05

申请公布日期：2005.07.19

申请人：

NEC TOKIN CORPORATION

发明人：AWAKURA YOSHIO;WATANABE SHINYA;SHIRATORI SATOSHI;ONO HIROSHI

分类号：H05K1/02;H05K3/24;(IPC1-7):H01P1/23;H05K9/00

主分类号：H05K1/02

摘要：In order to provide a wiring board comprising a magnetic material effective in suppressing spurious radiation in semiconductor devices and electronic circuits and the like that operate at high speeds, a wiring board ( 15 ) comprises an insulative base material ( 17 ), conductor patterns ( 19 a to 19 f) formed thereon, and magnetic thin films ( 21 a to 21 f) formed on the conductor patterns ( 19 a to 19 f). The magnetic thin film is configured of a magnetic loss material represented by M-X-Y, where M is at least one of Fe, Co, and Ni, X is at least one element other than M or Y, and Y is at least one of F, N, and O, the maximum value mu''max of the loss factor mu'' that is an imaginary component in the complex permeability characteristic of the magnetic loss material exists within a frequency range of 100 MHz to 10 GHz, and a relative bandwidth bwr is not greater than 200% or not smaller than 150% where the relative bandwidth bwr is obtained by extracting a frequency bandwidth between two frequencies at which the value of mu'' is 50% of the maximum mu''<SUB>max </SUB>and normalizing the frequency bandwidth at the center frequency thereof.