Heat spreader and semiconductor device package having the same,申请号US20040972689-传众专利搜索

Heat spreader and semiconductor device package having the same

申请公布号：US2005104195(A1)

申请号：US20040972689

申请日期：2004.10.25

申请公布日期：2005.05.19

申请人：

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

发明人：YANG YAW-YUH

分类号：H01L23/10;H01L23/31;H01L23/36;H01L23/433;H05K7/20;(IPC1-7):H01L23/10

主分类号：H01L23/10

摘要：The present invention relates to a heat spreader and a semiconductor device package having the same. The semiconductor device package comprises a substrate, a semiconductor die, a heat spreader, a molding compound and a plurality of solder balls. The die is mounted on the top surface of the substrate. The heat spreader comprises a heat spreader body and a supporting portion, wherein the heat spreader body a concavity that is lowered from an outermost edge to the central portion, and the supporting portion extends outwardly and downwardly from the outermost edge to form a cavity to accommodate the semiconductor die. The molding compound encapsulates the substrate, the semiconductor die and the heat spreader, but a top surface of the heat spreader body is exposed to the air. As a result, the concavity can increase heat dissipation area, provide a cushion effect and avoid the molding compound overflow during encapsulation.