Microelectromechanical device packages with integral heaters
申请公布号:US2004232535(A1)
申请号:US20030443318
申请日期:2003.05.22
申请公布日期:2004.11.25
发明人:TARN TERRY
分类号:B81B7/00;G02B26/08;H01L23/10;(IPC1-7):H01L23/02
主分类号:B81B7/00
摘要:A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
FORMING METHOD OF IMPURITY DIFFUSED LAYER
MANUFACTURING METHOD OF RUBBER MAGNET
METHOD OF MANUFACTURING HONEYCOMB HEATER
ALUMINUM ELECTROLYTIC CONDENSER
CONTROL CIRCUIT FOR DC CIRCUIT BREAKER
VINYL COMTAINING COLOR DEVELOPABLE COMPOUND
Easily struck non-metallic concrete shutter panel - has smooth plastic facing flexibly reinforced