Sealed and pressurized liquid cooling system for microprocessor

申请公布号：US6809928(B2)

申请号：US20020330915

申请日期：2002.12.27

申请公布日期：2004.10.26

申请人：

INTEL CORP

发明人：GWIN PAUL J;KONSTAD ROLF A;DAVISON PETER A;TRAUTMAN MARK A

分类号：G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20

主分类号：G06F1/20

摘要：According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

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