Electrochemical cell
申请公布号:US2004209163(A1)
申请号:US20040793288
申请日期:2004.03.04
申请公布日期:2004.10.21
发明人:WATANABE SHUNJI;KAITO TAKASHI;FUJII TOSHIAKI;IWASAKI KOUJI;WAKIYAMA SHIGERU
分类号:H01G9/155;H01M2/30;H01M2/32;(IPC1-7):H01M2/30
主分类号:H01G9/155
摘要:A tin coating is, for example, considered as a lead-free solder coating for a terminal attached to an electrochemical cell, but has presented a problem, as whiskers are likely to occur from the tin coating when the terminal is attached to the cell by laser welding. The formation of whiskers is due to the heat of laser welding and can be restrained by optimizing an undercoat layer of nickel or a nickel alloy.