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Electrochemical cell

申请公布号:US2004209163(A1)

申请号:US20040793288

申请日期:2004.03.04

申请公布日期:2004.10.21

申请人:
WATANABE SHUNJI;KAITO TAKASHI;FUJII TOSHIAKI;IWASAKI KOUJI;WAKIYAMA SHIGERU

发明人:WATANABE SHUNJI;KAITO TAKASHI;FUJII TOSHIAKI;IWASAKI KOUJI;WAKIYAMA SHIGERU

分类号:H01G9/155;H01M2/30;H01M2/32;(IPC1-7):H01M2/30

主分类号:H01G9/155

摘要:A tin coating is, for example, considered as a lead-free solder coating for a terminal attached to an electrochemical cell, but has presented a problem, as whiskers are likely to occur from the tin coating when the terminal is attached to the cell by laser welding. The formation of whiskers is due to the heat of laser welding and can be restrained by optimizing an undercoat layer of nickel or a nickel alloy.

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