ELECTRODE FOR ELECTROPLATING AND ELECTROPLATING METHOD FOR METALLIC STRIP USING THE SAME,申请号JP20020244564-传众专利搜索

ELECTRODE FOR ELECTROPLATING AND ELECTROPLATING METHOD FOR METALLIC STRIP USING THE SAME

申请公布号：JP2004083969(A)

申请号：JP20020244564

申请日期：2002.08.26

申请公布日期：2004.03.18

申请人：

JFE STEEL KK

发明人：SHIGENO MASAHIKO;NISHIHARA HIDEKI

分类号：C25D7/06;C25D17/12;(IPC1-7):C25D17/12

主分类号：C25D7/06

摘要：PROBLEM TO BE SOLVED: To provide electrodes with which, when a metallic strip is continuously subjected to electroplating, the plating uniform in a width direction can be performed without remarkably increasing the working cost thereof, and to provide an electroplating method for a metallic strip using the same electrodes. SOLUTION: As for the electrodes 1 for electroplating a metallic strip, on both end parts in the width direction of each electrode face confronted with the metallic strip S to be plated, slopes in which the spacing between the electrode face and the metallic strip S is made wide as it goes to the end part sides are formed, and the electrode face between both the slopes is made into a flat face. Further, the width of the slope is decided based on the position of an edge over coat generation region found from the distribution in the width direction of coating weight obtained when the metallic strip is electroplated with the flat electrodes having no slants on the electrode faces. The electrodes 1 for electroplating are provided so as to be confronted with the metallic strip S at prescribed intervals, and the metallic strip S is continuously passed inside a plating tank, so that electroplating is applied thereto. COPYRIGHT: (C)2004,JPO