METHOD AND DEVICE FOR TRANSPORTING SUBSTRATE,申请号JP20020086199-传众专利搜索

METHOD AND DEVICE FOR TRANSPORTING SUBSTRATE

申请公布号：JP2003282669(A)

申请号：JP20020086199

申请日期：2002.03.26

申请公布日期：2003.10.03

分类号：B65G1/00;B65G49/07;H01L21/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68

主分类号：B65G1/00

摘要：PROBLEM TO BE SOLVED: To provide a method and a device for transporting single wafer in which transport for an wafer and connection for the wafer between a wafer transport means and each processing device are prevented from being rate- controlled, and throughput is prevented from deteriorated, even if processes differ from one another for each processing device in a bay. SOLUTION: Each of bays 100, 200, 300,... is connected to an inter-bay transport line 400 through each of bay stockers 130, 230, 330,..., respectively. The bay 100 consists of a loop-like sheet-fed transport line 120, and processing devices 101-106 that are placed side by side along a direction crossing a transport direction of the inter-bay transport line 400. The processing devices 101-103 are placed side by side on one side of the sheet-fed transport line 120. The processing devices 104-106 are placed side by side on the other side of the line. The processing devices 101-106 comprises transport robots 11-16 and a chamber (not shown in a figure) in which a wafer W is processed one by one. COPYRIGHT: (C)2004,JPO