Ball grid array (BGA) mounting device,申请号US20000725559-传众专利搜索

Ball grid array (BGA) mounting device

申请公布号：US2002063318(A1)

申请号：US20000725559

申请日期：2000.11.29

申请公布日期：2002.05.30

申请人：

MOTOROLA, INC.

发明人：MITCHELL JAY ROBERT;JOHN RICHARD;LASHMET NAOMI

分类号：H01L23/498;H05K3/34;(IPC1-7):H01L23/02

主分类号：H01L23/498

摘要：An improved ball grid array assembly is disclosed. The assembly includes a ball grid array package (100), a substrate (104), and an insert device (108) interposed therebetween. Insert device (108) includes an array of contacts configured to couple to package (110) and an array of solder balls (112) configured to couple to a printed circuit board (116). Insert device (108) reduces stresses in the assembly caused by any mismatch of the thermal coefficients of expansion of BGA package (100) and printed circuit board (116).