,申请号JP19950007408-传众专利搜索

申请公布号：JP3282424(B2)

申请号：JP19950007408

申请日期：1995.01.20

申请公布日期：2002.05.13

分类号：H01C17/06;H01C7/00;H01C17/12;H01C17/242;(IPC1-7):H01C17/12

主分类号：H01C17/06

摘要：<p>PURPOSE: To provide a low cost and high reliability square thin film chip resistor which is generally used for an electronic circuit. CONSTITUTION: A pair of thin film top electrode layer 2 is formed on a main surface of a square-shaped 96% alumina board 1. A thin film resistor layer 4 is formed between thin film electrode layers so that it may be partially placed on the paired thin film top electrode layers 2, thereby forming a resin protective film layer 5 so that the thin film resistor layer 4 may be covered to a satisfactory extent while a conductor resin top electrode layer 6 is formed so that it may cover the thin film resistor layer 4 of the paired thin film top electrode layer 2 and be partially placed on both ends of the resin protective film layer 5. After the formation of the resin protective film layer 5, a pair of conductor resin rear surface electrode layer 3 are formed on the rear surface of the alumina board 1, thereby forming a pair of thin film end face electrode layers 7 on both ends of the 96% alumina board 1 so that it may be placed on the conductor resin top electrode layer 6 and the conductor resin rear surface electrode layer 3 respectively and forming an electrode plating layer 8 on the exposed electrode part.</p>