METHOD FOR IMPROVING BONDING OF RIGID, THERMOSETTING COMPOSITIONS TO HYDROPHILIC SURFACES, AND THE ARTICLES FORMED THEREBY,申请号US2001011985-传众专利搜索

METHOD FOR IMPROVING BONDING OF RIGID, THERMOSETTING COMPOSITIONS TO HYDROPHILIC SURFACES, AND THE ARTICLES FORMED THEREBY

申请公布号：WO2001079371(A2)

申请号：US2001011985

申请日期：2001.04.11

申请公布日期：2001.10.25

摘要：<p>A process for improving the adhesion between hydrophilic surfaces and the surface of thermosetting compositions that cure by a free radical process is disclosed. The process comprises pretreating the hydrophilic surface with an aqueous solution containing a zinc diacrylate, zinc dimethacrylate or combination thereof and a carrier, preferably a low molecular weight poly(vinyl alcohol)(PVA), drying the coating, applying the thermosetting composition, and curing the thermosetting composition. Quite unexpectedly, use of the aqueous adhesion promoting solution increased the peel strength (pli) by about 0.5 pli to about 5 pli, an improvement of up to 110 %. Additionally no undercut was seen after exposure to a sulfuric acid solution in laminate materials prepared with the aqueous adhesion promoting solution.</p>