BUMP JUNCTION AND ELECTRONIC COMPONENT
申请公布号:JP2001156207(A)
申请号:JP19990336057
申请日期:1999.11.26
申请公布日期:2001.06.08
发明人:KOMATSU IZURU;TADAUCHI KIMIHIRO;NAKAMURA SHINICHI;FUNAKURA HIROSHI;KAMATA SUSUMU
分类号:H01L23/12;H01L21/60;(IPC1-7):H01L23/12
主分类号:H01L23/12
摘要:PROBLEM TO BE SOLVED: To improve mechanical reliability of a bump junction by blocking the formation of a weak inter-metal compound composed of tin, gold and nickel by bonding zinc, which is concentrated on the surface of a solder ball, with the nickel plating when using tin/zinc solder. SOLUTION: By using a solder ball composed of solder alloy, which contains zinc, with tin as a substrate in place of tin/zinc solder constituting a conventional solder bump, a zinc layer concentrated on the surface of the solder ball is related to all junctions and blocks the reaction of tin, which forms the weak inter-metal compound.
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
METHOD FOR PRODUCING FLEXOGRAPHIC PRINTING PLATE AND FLEXOGRAPHIC PRINTING PLATE
COMPOSITE MESH DEVICES AND METHODS FOR SOFT TISSUE REPAIR
REDUCING POWER CONSUMPTION OR ERROR OF DIGITAL COMPASS
SYSTEMS AND METHODS FOR HARVESTING FOLLICULAR UNITS
Kleb- und Dichtstoffsystem mit Aushärtungsanzeige
Signalvorrichtung an einem Fahrzeug
Dishwasher, in particular household dishwasher
ARTICULOS MANUFACTURADOS A PARTIR DE UNA COMPOSICION DE PULPA