Bottom or top jumpered foldable electronic assembly, and method for manufacture,申请号AU19990058011-传众专利搜索

Bottom or top jumpered foldable electronic assembly, and method for manufacture

申请公布号：AU5801199(A)

申请号：AU19990058011

申请日期：1999.09.02

申请公布日期：2001.03.26

申请人：

CHRIS KARABATSOS

发明人：CHRIS KARABATSOS

分类号：H05K1/11;H05K1/14;H05K3/00;H05K3/36

主分类号：H05K1/11

摘要：An electronic assembly is made up of a number of rigid manufactured on the same or different substrates or panels and with the same materials separated from each other electrically and physically. One of the rigid circuit boards has a comb of printed tabs, or fingers, at the edge, which connects the assembly physically and electrically to a motherboard. Flexible wire jumpers bridges the comb to form electrical connections between the boards. Both boards have printed circuit tabs placed in alignment to each other on both boards across a gap which separates both boards. These tabs facilitate electronic interconnection of both boards via the flexible jumpers, which are groups or clusters of wires separated from each other via a flexible insulator. A method for manufacturing the assembly is also disclosed, in which two boards are created by cutting gaps from a substrate, leaving the two boards separated by a gap and connected by snap-offs. Once all the intended electronic components and the flexible jumpers are soldered onto the boards, the boards are rotated, snapping them apart. After a desirable spacing between components of both boards is achieved, both boards are pinned together to maintain achieved proximity.