PUNCH DIE ASSEMBLING METHOD AND PUNCH DIE,申请号JP19990212641-传众专利搜索

PUNCH DIE ASSEMBLING METHOD AND PUNCH DIE

申请公布号：JP2001038435(A)

申请号：JP19990212641

申请日期：1999.07.27

申请公布日期：2001.02.13

申请人：

AMADA ENG CENTER CO LTD;AMADA CO LTD

发明人：HAYASHI TETSUJI;TAKEHARA NORIO

分类号：B21D37/20;(IPC1-7):B21D37/20

主分类号：B21D37/20

摘要：PROBLEM TO BE SOLVED: To enable a punch shape exchange without having a play, at high accuracy and low cost by forming a punch chip mounting hole on a punch body, whose diameter is slightly smaller than that of the punch chip, heating the punch body, inserting the punch chip into the mounting hole and cooling it down. SOLUTION: On a punch body 3, a punch chip mounting hole 5, whose diameter is slightly smaller than that of a punch chip 7, is formed. A punch die 1 is formed in a way that the punch body 3 is heated and the punch chip 7 is inserted into the punch chip mounting hole 5 and cooled. When the punch chip 7 is changed with one's of another shape, a bottom end part of the punch body 3 is heated, the punch chip mounting hole is enlarged and the punch chip 7 is dismounted. Another punch chip 7 is mounted with the punch mounting hole 5 immediately and cooled down so as to perform the exchange of the punch chip 7. A tip end part of the punch chip 7 and the chip mounting hole 5 are made of round shape respectively, and it is preferable to install a detent pin on the punch chip 7.