FLEXIBLE LAMINATE FOR FLEXIBLE CIRCUIT,申请号US1999030487-传众专利搜索

FLEXIBLE LAMINATE FOR FLEXIBLE CIRCUIT

申请公布号：WO2000054969(A1)

申请号：US1999030487

申请日期：1999.12.20

申请公布日期：2000.09.21

摘要：<p>Method of forming a flexible circuit laminate (70) for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper (24) on a first side of a generally continuous strip of polyimide (22) having a layer of metal (23) on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a performed adhesive film (44) on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.</p>